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各位,由於拿到的IGS檔復雜,不能一次Shell成功,故用Offset外表面並Merge在一起,再Cut IGS檔生成的實體。其中遇到兩點問題:1)左下角DC Jack元件的圓孔Offset後也有一個圓孔,該圓孔處於一個孤面上;2)上方的文字Offset後也有破孔,也處於孤面上。請問該用什麼命令將其補起來?
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